BESI · BE Semiconductor
Semiconductor Materials & Equipment (back-end assembly / advanced packaging)
BESI·Semiconductor Materials & Equipment (back-end assembly / advanced packaging)
BE Semiconductor

BE Semiconductor

ConvictionModerate

Capital-equipment OEM: designs and sells assembly machines (die-attach, flip-chip, packaging, plating, hybrid bonding) to foundries, IDMs, and OSAT subcontractors, with a recurring tools/spares/service tail; fabless-style outsourced manufacturing and a lean, high-fixed-cost-leverage model.

Revenuefact
€591.3M FY25€184.9M Q1-26 (+28.3% YoY
Rev growthfact
FY25 -2.7% YoYQ1-26 +28.3% YoY, +11.1% QoQ
Gross marginfact
63.3% FY2563.5% Q1-26
Op marginfact
29.3% FY2534.6% Q1-26
Capex intensityfact
very low~2-3% of revenue (€15.6M LTM capex; €1.1M in Q1-26
Market cap
~€22.9B~$26B) (Jun 2026, fact
Across the boards

The thesis on this name

book · short

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Coverage leans bullish

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Earnings, margins & COGS, the income-statement breakdown, SWOT, moats & dependencies, the supplier–customer ecosystem graph, top signals & trends, and the valuation range.

  • Income statement & margin structure
  • SWOT, moats & dependency map
  • Supplier–customer ecosystem graph
  • Signals, trends & valuation range
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Not investment advice — analyst work product for a qualified professional.· intel vintage Jun 2026· sign in (free) for the analyst summary; Pro unlocks full intelligence
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