Hanmi Semiconductor
ConvictionContext
Capital-equipment OEM: designs and builds back-end assembly/packaging tools (flagship = TC Bonder for HBM die stacking, plus vision placement, EMI shield, laser/sawing systems) sold to memory and OSAT customers. Revenue is lumpy, order-driven, tied to customers' HBM capacity expansion cycles.
Revenue
FY2025 KRW 576.7B~$0.42B) - record revenue; Q1 2026 KRW 50.9B (~$37MRev growth
FY2025 revenue +3.2% YoYrecord) but operating profit -1.6% YoY; Q1 2026 revenue -65.5% YoY (HBM4-transition order digestionGross margin
not separately disclosedhistorically high; equipment gross margins ~50%+Op margin
FY2025 43.6%Q1 2026 ~16.6% (KRW 8.456B OP, -87.9% YoYCapex intensity
rising - building a ~KRW 100B dedicated Incheon hybrid-bonder plantJuan complex, completion targeted H1 2027) plus a new Incheon TC-bonder facility for next-gen capacityMarket cap
~$15.7BKRW 21.48T, KOSPI 042700, as of Jul 6 2026); down sharply from ATH KRW 426,000 / share on 2026-05-12The read
Where our coverage leans
Coverage leans bullish
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Full financial intelligence for Hanmi Semiconductor
Earnings, margins & COGS, the income-statement breakdown, SWOT, moats & dependencies, the supplier–customer ecosystem graph, top signals & trends, and the valuation range.
- Income statement & margin structure
- SWOT, moats & dependency map
- Supplier–customer ecosystem graph
- Signals, trends & valuation range
Not investment advice — analyst work product for a qualified professional.· intel vintage 2026-07· sign in (free) for the analyst summary; Pro unlocks full intelligence